AI Vision Solutions &
Embedded Systems Engineering
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Dual-Lens 360° Action Cameras

Real-time Object Detection, Tracking & Smart Video Analytics on the Edge
Designed a dual-lens 360° action camera based on Rockchip RV1109 with two Sony IMX172 fisheye lenses. Two SKUs: wearable, battery-powered and fixed, vehicle-mounted with external DC input. Real-time 360° stitching, hardware H.264/H.265 encoding, Wi-Fi streaming,local eMMC and microSD recording. Low-power, rugged, vibration-resistant design with synchronized sensors, IMU/EIS, and remote control via mobile app.

Project Summary

4K imaging with Sony IMX and hardware H.265/H.264 encoding
Optimized Buildroot firmware with custom V4L drivers
Low-power architecture (<10 W) with stable thermal and electrical performance
Full-cycle development: 10-layer HDI PCB, firmware, mechanics, and mass-production support
Dual-lens 360-degree panoramic camera prototype with Sony IMX sensors
Full-cycle R&D
In-house laboratory
100% Job Success
(Upwork & Linkedin)

Project Overview

Built a compact 360° camera platform around Rockchip RV1109 with dual Sony IMX172 fisheye modules positioned back-to-back. The sensors are time-synchronized, frames are stitched on-device to an equirectangular stream with optional electronic image stabilization.

Two product variants share the same core electronics:
Wearable (helmet/POV): Li-ion battery pack with PMIC, USB-C charging, on-device recording, low-power modes, quick-release mount.
Fixed (vehicle/rig): 9–36 V DC input with surge/ignition protection, antennas, sealed connectors.
Common features: hardware H.264/H.265 encoding, Wi-Fi (dual-band) + BLE for control, microSD + eMMC storage, RTSP/RTMP streaming, on-device analytics (motion/objects) using the RV1109 NPU/ISP pipeline, and a simple HTTP/WS API for remote control. Mechanics: rugged, splash-resistant housing, thermal path to chassis, anti-vibration mounts.
Result: a versatile 360° camera that works as a wearable or vehicle-mounted unit, delivering low-latency panoramic video, reliable recording, and edge analytics without cloud dependency.

Our Solution

✅ OUR WORK:
▪️ Schematic and PCB design
▪️ Case Design
▪️ Sample making (PCB and case)
▪️ Porting of the Linux kernel (Buildroot), device tree and drivers
▪️ Software Development for Testing
▪️ Electronic bring-up and testing
✅ INTERFACES:
▪️ SoC – Rockchip RV1109
▪️ Image sensor – Sony IMX172
▪️ 2 x DDR3 2GB
▪️ 1 x USB 2.0
▪️ 1 x Wi-Fi Murata
▪️ 1 x MIPI CSI-2
▪️ 1 x eMMC 64GB
▪️ 1 x SD card
▪️ Audio MIC
▪️ Power supply Battery and DC 5V – 12V

✅ PCB:
▪️ Stackup – 10 layers
▪️ PCB – 1200+ components
▪️ 4300+ pads
▪️ 4500+ vias
About Us

What We Design

We create reliable, production-ready electronics hardware for AI, embedded, industrial, and IoT applications — from compact controllers to high-performance computing AI modules and servers.

Specialize in:

SoC, CPU, FPGA & Carrier Boards — high-speed designs with DDR, PCIe, MIPI CSI-2, USB 3.0, Ethernet.
AI Vision Boards — camera and sensor integration, ISP channels, and power management for machine vision systems.
Industrial Controllers & IoT Devices — modular designs with wide temperature range, PoE, and CAN interfaces.
Power and Battery Boards — DC/DC converters, battery management, protection, and charging circuits.
Communication Modules — Wi-Fi, Bluetooth, Ethernet, RS-485, and custom radio links.
Custom CPU and SoC boards for high-performance embedded systems
CPU and SoC boards
FPGA system board for hardware acceleration and signal processing applications
FPGA Systems
Compact IoT device PCB with wireless connectivity and low-power microcontroller
IoT  Devices
Wireless communication module PCB with integrated radio and antenna circuitry
Wireless Modules
Embedded camera board with image sensor and MIPI interface for vision systems
Cameras & Sensors
Carrier Boards
Microcontroller-based control board with power management and I/O interfaces
MCU Devices
Flexible flat cable and connector assembly for PCB interconnection
FFC and FPC cables
Each design is optimized for signal integrity, thermal stability, and cost-efficient manufacturability.
Have a concept or draft schematic?
Let’s turn it into a manufacturable design.
Let’s Build Your Next Electronics Design →

From Firmware to Complete Embedded Systems

Our engineers develop reliable embedded software for industrial, IoT, and AI-vision devices.
We handle the full software stack — from low-level drivers to user-level applications and optimization for production.
Microcontroller unit used for firmware development and real-time embedded control
Firmware for Microcontrollers
RTOS integration, interfaces such as I²C, SPI, UART, CAN, and USB.
FPGA chip used for hardware acceleration and embedded HDL development
FPGA and HDL logic
High-speed data processing and interface logic on FPGA platforms.
System-on-Chip representing high-performance embedded computing hardware for AI and vision applications
Embedded Linux
Development of BSP, bootloaders, Device Tree and kernel modules
Our experience covers systems running on Linux, RTOS, and custom bare-metal environments.
Let’s Build Your Next Embedded System →

Five Problems Our Clients Come to Us With

Real challenges that block progress in AI vision and embedded systems development projects
Embedded Linux boot failure during system bring-up and kernel initialization
The business grows faster than the engineering team
As products evolve, the complexity of electronics and systems increases faster than internal teams can scale.
Hiring experienced hardware and embedded software engineers is slow, expensive, or simply impossible, preventing companies from scaling and moving on to more complex, high-margin projects.
In such moments, companies need an external engineering capacity they can rely on immediately.
High cost of finished devices, need to reduce the cost of components
In many cases, the market price of components, such as carrier boards, sensor boards, and camera modules, is several times higher than the actual production cost.
This leads to increased production costs, reduced profits, and a decrease in the competitiveness of end devices.
This is where custom hardware design becomes a strategic advantage, not an expense.
The platforms available on the market do not meet the requirements
Off-the-shelf hardware and software often fail to meet the actual project requirements.
The required interfaces, performance, or software management are missing, limited, or not configurable.
As a result, teams are forced to make compromises that violate the system architecture or product vision.
We come to the rescue when existing solutions fail to meet project requirements.
Vendor technical support cannot resolve real engineering issues
In many cases, vendor technical support is limited to formal or standard responses and documented use cases.
When changes to custom drivers, low-level debugging, or hardware measurements are required, support is often unable to help. This can completely block development and halt the entire project.
In such cases, projects require direct access to engineers who can solve any issues.
Implementing projects requires a wide range of deep knowledge
Complex systems require collaboration between hardware design, firmware development, and system software.
Relying on individual freelancers is risky and difficult to manage, while outsourcing to engineering firms is often prohibitively expensive. This can lead to significant bottlenecks and high project implementation costs.
Companies are then looking for an engineering team that combines deep expertise with predictable costs.
In these situations, progress depends on direct access to engineers who work below the abstraction layer and take responsibility for the full system.
Discuss your technical challenge →

Turning Your Pain Into Measurable Results

Real examples of solved problems, cost reduction, and risk mitigation.
Successful embedded Linux system boot after debugging and configuration
Cost Optimization
Custom-designed carrier boards instead of expensive modules.

▪️ Market price: $250–350 per unit
▪️ Custom design cost: <$50 per unit
▪️ Diff: $250 - $50 = $200 per unit
▪️ Volume: 5,000 units per year
▪️ Calc: $200 * 5,000 pcs = $1,000,000
Total savings $1,000,000+ per year*
From MVP to Investment
The client had a good software product, but poorly designed hardware and firmware were hindering demonstrations and investor validation.

Result:
After stabilizing the MVP and resolving low-level technical issues, the startup was able to move on to investor demos.
Next funding round secured $500,000*
Time-to-Market Acceleration
Unblocking stalled projects

Problem: The phy interface chip is unstable.
SoC vendor support: 8 weeks, no solution found.
Vendor solution: Replace the chip, make changes to the PCB, no guarantee of results.
Our involvement: 10 days, debugging and Low-level driver
Working prototype provided, project unlocked*
Savings on hiring
Scaling without building an in-house team, workspace, and expensive lab equipment.

▪️ Hiring senior engineer: 3–6 months
▪️ Annual cost per engineer: $110,000-$150,000
▪️ Additional expenses: $50,000-$100,000

▪️ Our model: immediate start, predictable cost
Save 3-6 months and 1.5 - 2 times more money*
📌 *Based on real projects. Details available upon request.
For our clients, engineering is not an expense — it’s a lever for growth.
Review your project economics

Our Services

We provide end-to-end hardware and firmware development for AI vision and embedded systems,
specializing in NVIDIA Jetson, Rockchip, NXP, Sony, Omnivision and other platforms.
From custom PCB design to firmware, BSP, and enclosure engineering — we cover the entire product lifecycle.
View All Services →

How We Work

We start with a deep technical consultation to define your system architecture,
followed by full-cycle development — from schematics and enclosure design to firmware and software integration.

01

Consultation
Architecture planning, selection components, and interface definition for platforms

02

Development
Hardware design, PCB layout, enclosure, firmware, and BSP integration — full-cycle R&D

03

Support
Testing, optimization, and production readiness assistance

Get in touch with our engineers ->

Projects

We design and build advanced embedded systems, AI cameras, and custom electronics — from Jetson carrier boards and sensor modules to complete AI vision platforms.
View All Projects →
Advanced Equipment for Electronics Testing and PCB Development

Our state-of-the-art laboratory equipment

Our lab allows to rapidly prototype, debug, and validate complex embedded systems, ensuring reliability before production.

Measurement & Analysis:

High-frequency oscilloscopes and spectrum analyzers
Logic analyzers and signal generators
RLC meters, multimeters, precision power supplies

Assembly & Prototyping:

Soldering and reflow stations
Rework tools for prototype repair
3D printer and CNC machining
ATEH.tech in-house electronics laboratory with oscilloscopes, signal analyzers and soldering equipment
Engineer using oscilloscope for analog signal measurement
Analog Measurement
Professional soldering and reflow tools in ATEH.tech lab
Soldering 
Tools
Logic analyzer and digital signal measurement setup
Digital Measurement
High-precision RLC and power supply instruments
high-precision instruments

Engineering Capabilities & PCB Expertise

We design and prototype advanced printed circuit boards for embedded and AI vision systems.
Our expertise includes: high-speed, RF, power, and HDI multilayer PCBs, as well as manual prototyping and testing.
Work with all types IC package types: BGA, LGA, QFN, etc.
PCB types: HDI, Multilayer, High-Speed, Wireless, FFC, FPC cables, and Rigid-flex PCBs.
Production, bring-up, and testing of prototypes and samples.
Manual assembly of components for rapid prototyping, modification, and repair of PCB.
high-speed PCB design with PCIe, USB 3.1, HDMI, and MIPI interfaces

High-Speed Interfaces

PCI Express, NVMe, USB3, USB type-C, LVDS, SLVS, SLVC-EC, MIPI CSI, Ethernet, SATA, SFP, MIPI DSI, HDM
Multilayer PCB stackup design with blind and buried vias

Multilayer PCB

We have extensive experience in developing multilayer PCBs with blind, buried, and micro-vias.
Compact embedded electronics board with USB interface and Murata Wi-Fi module

Radio Interfaces

Wi-Fi, Bluetooth, NFC, Zigbee, GSM, GPRS, 2G, 3G, 4G, LTE, GNSS with Ceramic, and PCB antennas

High-Density PCB

HDI is designed to pack circuitry into a smaller space, allowing for increased circuit density
PCB power circuit with PoE and DC/DC converters

Power Supply

We use different types of power supplies:
PoE, PoE+, PoE++, AC/DC, DC/DC
PCB assembly with BGA, LGA, and QFN chip housings

BGA, LGA, QFN Cases

We develop circuits and printed circuit boards with any type IC package: BGA, LGA, QFN

Team Led message

Artem T.
Since childhood, I’ve been passionate about electronics and programming — assembling various toys, circuits, and experimental devices. As I grew older, this passion evolved into a lifelong commitment to engineering, leading me to earn a degree in Electronics Engineering. Since then, I’ve continually expanded my knowledge and spent many years working in AI solutions, embedded systems, and product development.

Over the years, I’ve gained extensive expertise in electronics, firmware, and software. I truly enjoy designing and improving electronic devices — every stage of the process, from concept and design to production, brings me great satisfaction.

With over 20 years of experience in electronics and firmware development, I bring a deep technical foundation and creative problem-solving mindset to every project. Together with my team, we’ve successfully delivered over 40 commercial products, most of which are now in production.

We take pride not only in our engineering excellence but also in providing exceptional customer support, ensuring that every client enjoys a seamless and successful experience working with us.

Meet Team

Our team has a deep understanding of electronic and PCB design, EMI, Embedded Linux, drivers, FPGA, and firmware development.
Five engineers from ATEH.tech standing in a modern electronics laboratory wearing black shirts with the ATEH.tech logo
True Stories

Why are so many teams like yours choosing us

Custom Carrier Board Case Study: Robotics Vision System

Problem
A robotics R&D company needed a reliable carrier board for NVIDIA Jetson Platform with multiple camera inputs and strict EMI constraints.

Solution
ATEH.tech developed a 8-layer, EMC-optimized carrier board supporting two MIPI CSI-2 cameras, Gigabit Ethernet, and NVMe. This design reduced interference and simplified integration.

Result
The new board cut prototyping time by 25 % and enabled the client to launch an autonomous vision system within schedule and budget.
"ATEH.tech delivered a board that perfectly matched our technical and production needs. Their fast support and documentation made integration smooth. We’re already planning our next Jetson-based platform with them."

Client: Robotics R&D Company
Project Manager, Robotics Hardware Division

Upwork Client Testimonials

Consistently positive feedback from 100% of our clients!
Exceptional quality delivered every time!

Here are some questions we are often asked

If your question is not listed here, then please contact us.
Ask a question
What exactly does ATEH.tech do?
ATEH.tech is an engineering team specializing in AI vision and embedded systems development.
We design and build custom hardware and firmware solutions for intelligent devices — from early concept to production.
Our expertise includes embedded platforms, camera systems, image sensors, and edge AI technologies.
What types of solutions are available from ATEH.tech?
We provide a wide range of custom electronic and embedded solutions tailored to client needs.
Our services cover board design, prototyping, firmware development, sensor integration, and complete system design for vision, robotics, and IoT applications.
What is the process for developing a custom solution with ATEH.tech?
Our process begins with understanding the client’s technical and business goals.
We define system architecture, select components, design hardware and firmware, validate prototypes, and support manufacturing — ensuring smooth transition from prototype to mass production.
What are some examples of previous projects ATEH.tech has worked on?
ATEH.tech has developed a variety of intelligent systems, including AI cameras, embedded computing modules, machine vision devices, and industrial automation platforms.
Our experience spans across domains such as robotics, transportation, security, and research.
What is the expected turnaround time?
The turnaround time depends on the complexity and scope of the project.
However, our optimized design workflow enables us to deliver fast results without compromising quality.
Please contact us for a customized time estimate.
Does ATEH.tech provide ongoing support and maintenance?
Yes. We provide long-term technical support, firmware updates, and production assistance to ensure stable operation and product reliability throughout its lifecycle.
What makes ATEH.tech different from other engineering or PCB design companies?
ATEH.tech stands out for its deep expertise in AI Vision and Embedded Systems Engineering.
We combine electronics, optics, firmware, and AI to create complete intelligent solutions — not just hardware.
Our customer-focused approach, innovation, and engineering precision ensure exceptional results from concept to production.
Contact us today!

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© 2019-2026. ATEH.tech — Engineering Team
AI Vision Solutions &
Embedded Systems Engineering

All rights reserved.
All trademarks are the property of their respective owners.

Georgia, Tbilisi
+995 (591) 93-83-18
[email protected]
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