CARRIER BOARDS
Custom Carrier Board Design for NVIDIA Jetson
We have designed more than 10 custom carrier boards for NVIDIA Jetson platforms, from compact Orin NX and Orin Nano modules to high-performance AGX Orin systems. Our designs are optimized for AI vision, robotics, industrial automation, and edge AI with high-speed interfaces, robust power architecture, and production-ready hardware.
10+ Commercial Jetson Carrier Boards
PCIe x8 Gen4, MIPI CSI-2/DSI, USB 3.2, SLVS, NVMe SSD
Production-Ready Hardware, BSP and Drivers
Up to 12-Layer HDI High-Speed PCB Design
High-Speed Interfaces
PCIe Gen4, MIPI CSI-2, USB 3.2, Ethernet, NVMe SSD
Industrial Design
Wide input voltage, EMC, thermal optimization
Embedded Linux BSP
Bootloader, kernel, device tree, V4L
drivers
drivers
Production-Ready Design
DFM, testing, bring-up, manufacturing support
Signal Integrity
DDR4, PCIe, USB, HDMI, SI/PI optimization
AI Vision
Sony IMX sensors, GMSL, ISP, multi-camera mode
Engineering at a Glance
Applications
Our boards have been successfully deployed in:
▪️ AI video cameras and smart surveillance
▪️ Industrial IoT and low-power edge devices
▪️ Autonomous robots and motor-control systems
▪️ Industrial mini-PCs and embedded automation
▪️ AI vision in medical scope systems
▪️ Industrial IoT and low-power edge devices
▪️ Autonomous robots and motor-control systems
▪️ Industrial mini-PCs and embedded automation
▪️ AI vision in medical scope systems
What We Deliver
✔ Custom Carrier Boards
✔ Embedded Linux BSP
✔ V4L Camera Drivers
✔ Production Support
✔ High-Speed PCB Design
✔ Signal & Power Integrity
✔ Embedded Linux BSP
✔ V4L Camera Drivers
✔ Production Support
✔ High-Speed PCB Design
✔ Signal & Power Integrity
▪️ Orin NX
▪️ AGX Orin
▪️ Orin Nano Super
▪️ TX2 NX
▪️ Xavier NX
▪️ AGX Xavier
▪️ AGX Orin
▪️ Orin Nano Super
▪️ TX2 NX
▪️ Xavier NX
▪️ AGX Xavier
Engineering Challenges
✔ Multi-camera integration
Boards optimized for up to 6 Sony IMX sensors, multi-stream video, and synchronized triggering.
✔ High-speed signal routing on small PCB
PCIe Gen4, MIPI CSI-2/DSI, NVMe SSD, USB 3.x, SLVS-EC interfaces for Sony sensors.
✔ JetPack, BSP and drivers
Adapting configurations across multiple Jetson Platforms and JetPack releases.
✔ Dense high-complexity PCB
Stackup - up to 12 layers, 1200+ components, 3800+ vias,
✔ Reliable power supply systems
Stable operation in harsh conditions: automotive, industrial, temperature variations.
✔ Compact mechanical constraints
Ultra-dense layouts for embedded devices and miniature enclosures.
Gallery
Key Parameters
Interfaces:
▪️ 3× USB 3.1
▪️ 1× USB 2.0
▪️ 2× Ethernet
▪️ 4× MIPI CSI-2
▪️ SLVS (Sony sensors)
▪️ PCIe to SATA
▪️ PCIe x4 / x8
▪️ M.2 (SATA / PCIe)
▪️ HDMI
▪️ GPIO, SPI, I2C
▪️ Power: DC 19V up to 200W
▪️ 3× USB 3.1
▪️ 1× USB 2.0
▪️ 2× Ethernet
▪️ 4× MIPI CSI-2
▪️ SLVS (Sony sensors)
▪️ PCIe to SATA
▪️ PCIe x4 / x8
▪️ M.2 (SATA / PCIe)
▪️ HDMI
▪️ GPIO, SPI, I2C
▪️ Power: DC 19V up to 200W
PCB:
▪️ Stackup - up to 12 layers
▪️ 1200+ components
▪️ 4300+ pads
▪️ 3800+ vias
▪️ High-density multilayer PCB
▪️ Stackup - up to 12 layers
▪️ 1200+ components
▪️ 4300+ pads
▪️ 3800+ vias
▪️ High-density multilayer PCB
Project Results
ATEH.tech delivered a complete hardware platform from concept to functional engineering prototypes, including:
✔ Hardware architecture
✔ Schematic design
✔ Mechanical enclosure design
✔ Prototype manufacturing
✔ L4T Embedded Linux
✔ L4T Linux kernel porting
✔ Device Tree development
✔ Driver development
✔ Manufacturing support
✔ Board bring-up
✔ Functional validation
✔ Production-ready engineering samples
✔ Hardware architecture
✔ Schematic design
✔ Mechanical enclosure design
✔ Prototype manufacturing
✔ L4T Embedded Linux
✔ L4T Linux kernel porting
✔ Device Tree development
✔ Driver development
✔ Manufacturing support
✔ Board bring-up
✔ Functional validation
✔ Production-ready engineering samples
LET'S WORK TOGETHER
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